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1. Draw a diagram showing how a typical wafer flows in a sub-micron CMOS IC fab. 2. Give an overview of the six major process areas and the sort/test area in the wafer fab. 3. For each of the 14 CMOS manufacturing steps, describe its primary purpose. 4. Discuss the key process and equipment used in each CMOS manufacturing step.Get A Quote
Great energy conservation, wide adjustment range, low noise and little dust
1.5 times or even 2 times larger crushing cavity than that of other crushers, large feeding mouth
With features of reliable structure, high working efficiency and easy adjustment
VSI sand maker, also called VSI crusher, is the major machine for sand making plant.
Ball mill is the key machine to grind the crushed materials. Ball mill machine is widely used to process cement, silicate product, building material, refractory material, fertilizer, ceramics and glass, etc.
On the basis of domestic mills, fote raymond mill is produced. The raymond roller mill enjoys the features of high working efficiency, low energy consumption, small floor space and small cost.
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